Last edited by Nele
Thursday, July 23, 2020 | History

2 edition of 1993 IEEE Multi-Chip Module Conference McMc-93 found in the catalog.

1993 IEEE Multi-Chip Module Conference McMc-93

1993 IEEE Multi-Chip Module Conference McMc-93

March 15-18, 1993 Santa Cruz, California

  • 287 Want to read
  • 40 Currently reading

Published by Ieee Computer Society .
Written in English

    Subjects:
  • Computer Books: General

  • The Physical Object
    FormatHardcover
    Number of Pages203
    ID Numbers
    Open LibraryOL11389586M
    ISBN 100818635428
    ISBN 109780818635427

    Proceedings IEEE Multi-Chip Module Conference, Publ by IEEE, pp. , Proceedings of the IEEE Multi-Chip Module Conference - MCMC, Santa Cruz, CA, USA, 3/15/ Pan G, Zhu X, Gilbert B. Quasi-static analysis of fuzz button : G. Pan, X. Zhu, B. Gilbert. Chip scale packaging Information on IEEE's Technology Navigator. Start your Research Here! Chip scale packaging-related Conferences, Publications, and Organizations. IEEE-USA E-Books. standards IEEE Std ,1 IEEE Std , and IEEE Std ; and general language enhancements in the areas of design and.

    Pan, G, Zhu, X & Gilbert, B , Quasi-static analysis of fuzz button interconnects. in Proceedings IEEE Multi-Chip Module Conference. Proceedings IEEE Multi-Chip Module Conference, Publ by IEEE, pp. , Proceedings of the IEEE Multi-Chip Module Conference - MCMC, Santa Cruz, CA, USA, 3/15/Author: G. Pan, X. Zhu, B. Gilbert. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). in Multi-Chip Module Conference, MCMC, Proceedings., IEEE, , ppAuthor: Zaliman Sauli, Vithyacharan Retnasamy, Fairul Afzal Ahmad Fuad, Phaklen Ehkan, Steven Taniselass.

    Professor Wayne W.-M. Dai received the B.A. degree in Computer Science and Ph.D. degree in Electrical Engineering from the University of California at Berkeley, in and , respectively. He was the founding Chairman of the IEEE Multi-Chip Module Conference, . Printed circuit board (PCB) power distribution network (PDN) design performance depends on the peak voltage ripple caused by the integrated circuit (IC) switching currents. The input impedance seen by the IC looking into the PCB PDN can be calculated using a physics-based circuit model extracted from the cavity model approach. The input impedance is fitted to a simplified circuit model used to.


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1993 IEEE Multi-Chip Module Conference McMc-93 Download PDF EPUB FB2

Get this from a library. Proceedings, IEEE Multi-Chip Module Conference: MCMC [IEEE Circuits and Systems Society.;]. Get this from a library. Multi-Chip Module Conference, MCMC, Proceedings., IEEE. [Institute of Electrical and Electronics Engineers;]. Get this from a library. IEEE Multi-Chip Module Conference, [Institute of Electrical and Electronics Engineers, Inc.

Staff,] -- Papers delivered at the Santa Cruz, Calif. meeting held March, (under multiple sponsorship) on high speed systems, infrastructure, new. Get this from a library.

IEEE Multi-Chip Module Conference, MCMC, March, Santa Cruz, California: proceedings. [IEEE Circuits and Systems Society.;]. Proceedings IEEE Multi-Chip Module Conference Location: Santa Cruz, CA, USA Proceedings IEEE Multi-Chip Module Conference (Cat.

NoCH) Location: Santa Cruz, CA, USA Proceedings of IEEE Multi-Chip Module Conference (MCMC) Location: Santa Cruz, CA, USA Proceedings of IEEE Multi-Chip Module Conference (MCMC) Location: Santa Cruz, CA, USA.

For the pretreatment of aluminum bondpads, a commercial zincate solution was modified. Published in: Proceedings IEEE Multi-Chip Module Conference MCMC Article #: Date of Conference: May Date Added to IEEE Xplore: 06 August ISBN Information: Print ISBN: 0 Cited by: Efficient transient simulation of lossy interconnect Efficient transient simulation of lossy interconnect Published in: 28th ACM/IEEE Design Automation Conference.

Article #: Proceedings IEEE Multi-Chip Module Conference MCMC Published: Cited by: A quasi-static analysis of fuzz button interconnects Published in: Proceedings IEEE Multi-Chip Module Conference MCMC Article #: Date of Conference: May Date Added to IEEE Xplore: 06 August ISBN Information: Print ISBN: INSPEC Author: G.

Pan, X. Zhu, B. Gilbert. IEEE sponsors more than 1, annual conferences and events worldwide, curating cutting-edge content for all of the technical fields of interest within IEEE. Use the IEEE conference search to find the right conference for you to share and discuss innovation and interact with your community.

Design tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies are described.

MCM-C includes cofired alumina Proceedings IEEE Multi-Chip Module Conference MCMC Article #: Date of Conference: May Date Added to IEEE Xplore: 06 August ISBN Information:Cited by: 1. 9.) IEEE Multi-Chip Module Conference McMc MarchSanta Cruz, California Institute of Electrical and Electronics Engineers IEEE Computer Society Press, [paperback] [English]; ) International Workshop on Vlsi Process and Device Modeling: ( Vpad), May 14 (Fri.) – May 15 (Sat.),Nara Ken-New Public Hall, Nara, Japan ( Vpad.

A High-Performance Second-Generation Sparc Mcm Conference Paper (PDF Available) in Proceedings of SPIE - The International Society for Optical Engineering - May with 71 Reads. Integral decoupling capacitance reduces multichip module ground bounce.

Conference: Multi-Chip Module Conference, MCMC, Proceedings., IEEE. Cite this publication. Jarwala N Designing "Dual personality" IEEE compliant multi-chip modules Proceedings of the international conference on Test, () Maly W, Feltham D, Gattiker A, Hobaugh M, Backus K and Thomas M () Smart-Substrate Multichip-Module Systems, IEEE Design & Test,(), Online publication date: 1-Apr Proceedings IEEE Multi-Chip Module Conference MCMC; ; A passivity approach to controller-observer design for robots.

Harry Berghuis, Henk Nijmeijer; Mathematics, Computer Science; IEEE Trans. Robotics and Automation; ; Lyapunov control in robotic systems: tracking regular and chaotic dynamics. Henk Nijmeijer, Harry Berghuis. Buy IEEE Multi-Chip Module Conference McMc MarchSanta Cruz, California Proceedings by Institute of Electrical and Electronics Engineers, Inc - Ieee Multi-chip Module Conference: February, Santa Cruz, California: Proceedings by Ieee.

IEEE membership offers access to technical innovation, cutting-edge information, networking opportunities, and exclusive member benefits. Members support IEEE's mission to advance technology for humanity and the profession, while memberships build a platform to introduce careers in technology to students around the world.

Abstract. Electron beam probing is applied for test and analysis of miniaturised MCM structures. Wiring structures are tested for shorts and opens while fully assembled MCMs are analysed in order to identify process or design problems [1,2].Cited by: 1.

Get this from a library. Multi-Chip Module Conference (MCMC). [Institute of Electrical and Electronics Engineers, Inc. Staff,] -- MCMC is unique in its multi-disciplinary coverage of all aspects of multi-chip modules, with particular emphasis on system applications, technology, design and test, infrastructure, and education.

A new simple geometric technique is presented for analyzing the stability of difference formulas for the model delay differential equation \[ y'(t) = py(t) + qy(t - \delta), \] where p and q are complex constants, and the delay $\delta $ is a positive constant.

The technique is based on the argument principle and directly relates the region of absolute stability for ordinary differential Cited by:. Proceedings IEEE Multi-Chip Module Conference. IEEE Comput.

Soc. Press. pp. – doi/mcmc to four compartments referred to as "books". Each book comprises a multi-chip module (MCM) of processing units of VLSI interconnects in multichip modules," Proceedings of IEEE Multi-Chip Module Conference (MCMC),pp. Proceedings IEEE Multi-Chip Module Conference MCMC; ; VIEW 2 EXCERPTS.

Numerical solution of 2-dimensional scattering problems using a transmission-line matrix. Peter B. Johns, Published in IEEE Symposium on Electromagnetic Compatibility and Signal Integrity Yoshimura and E.

S. Kuh, "Efficient Algorithms for Channel Routing," IEEE Trans. on Computer- Aided Design of iCs and System, vol. 1, pp.Jan. Google Scholar Digital Library 5.